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silicon wafer

美英

un.硅片；硅圆片
网络矽晶圆；硅晶圆；矽晶片

silicon wafer

silicon wafer

英-汉网络释义

silicon wafer

un.

1.硅片

2.硅圆片

1

I went into a clean room with a fresh silicon wafer , and then I just cranked away at all the big machines for about 100 hours .

我在无菌室操作一片硅晶片，接着我周转于所有这些大型机器中大约 100个小时。

2

Chip : The individual circuit or component of a silicon wafer , the leadless form of an electronic component .

芯片：单回路或元件的硅晶元，无引脚的电子元件。

3

Contamination Particulate - Particles found on the surface of a silicon wafer .

沾污颗粒 -晶圆片表面上的颗粒。

4

The surface grinding temperature of the silicon wafer ground by diamond wheels is studied .

研究金刚石砂轮磨削单晶硅片时的表面磨削温度。

6

7

and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through .

硅片台内设有若干柱孔，供可伸缩真空柱贯穿其中。

8

The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole .

该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。

9

The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof.

本发明提供了一种硅片交接装置及其硅片交接方法。

10

Researchers took a 200-millimeter silicon-wafer chip and drilled a 3-nanometer-wide hole (known as a nanopore) through it .

研究人员那一片 200 毫米的硅片芯片并在上面打上直径 3 纳米的孔（称为纳米孔）穿过它。

13

Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer .

沾污区域 -部分晶圆片区域被颗粒沾污，造成不利特性影响。

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17

ZHANG Y X. Study on surface layer damage in monocrystalline silicon wafer induced by ultra-precision grinding [D ].

张银霞。单晶硅片超精密磨削加工表面层损伤的研究 [D ]。大连理工大学，2006 。

18

The new device is a silicon wafer about the shape and size of a playing card .

这个新设备是一张纸牌大小的硅晶片。

19

YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer .

YMS-50 激光切割机是专用于太阳能硅片电池切割的设备。

20

Using silicon wafer as substrate makes compatibility with IC technology possible .

使用硅片作为衬底使得与 IC 工艺的兼容成为可能。

23

Such being the case , the bare silicon wafer CMP has progressed toward planarization polishing or CMP for LSI devices .

既然如此，裸硅晶片的 CMP 平坦化抛光对已取得进展或 LSI 器件中医。

24

Base Silicon Layer - The silicon wafer that is located underneath the insulator layer , which supports the silicon film on top of the wafer .

底部硅层 -在绝缘层下部的晶圆片，是顶部硅层的基础。

25

Research progresses in recent 10 years in metallic microcontamnation of silicon wafer during wet cleaning are briefly reviewed .

综述了近 10 年来国内外在半导体矽片金属微观污染研究领域的进展。

28

Hot plate with silicon wafer lowered to heating position .

加热板与矽晶圆降低至加热位置。

30

Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes.

测试晶圆片 -用于生产中监测和测试的晶圆片。

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